Companies in the semiconductor industry have a good reason to be ecstatic about their future. Why? In a recent data released by WSTS (World Semiconductor Trade Statistics), worldwide semiconductor market is forecasted to be USD 298 billion in 2013; to be historical high in 2014 at 5.1% growth or USD 313 billion; and, the trend is expected to continue in 2015 as it will reach USD 325 billion, which is 3.8% up.
So, just like the other semiconductor industry segments, the figures above mean one thing to the silicon wafer cleaning technology manufacturers: a promising future for their business. Thus, those individuals/companies who are working and making innovations for silicon wafer cleaning processes should double their effort to continue to innovate in order to serve this rapidly-growing industry even better.
As of today, the kinds of silicon wafer cleaning processes/technologies being utilized in the industry can be classified into three types and these are the following:
Dry cleaning - this particular cleaning technology involves several techniques, which include these processes: Ozonated chemistries (aka UV-ozone clean) that is known to be environmentally friendly alternative to sulfuric acid; Dry Ice (CO2 based; Aerosols, which relies on a momentum transfer mechanism; Vapor Phase; and, the Laser Assisted method.
Wet process - just like the dry process, there are also several techniques used under the wet process and these include: Immersion (immerse cassette in chemical bath); the megasonic cleaning, which is a type of acoustic cleaning that uses vibrational scrubbing method in a non-contact mode; the Centrifugal Spray method, which involves spraying freshly blended chemicals and high purity water; and, Aqueous cleaning that uses at least 95% water in the process.
The dry-wet combination - also known as the alternative method.
While the silicon wafer cleaning process has come a long way from its inception, there is still a room for improvement, which gives an opportunity to serve the semiconductor industry even better. Through continued research and and experiments, manufacturers will surely come up with new technological innovations that help in the industry not just in hastening the processes but will further improve the quality of the product output in the most convenient and inexpensive ways.
So, just like the other semiconductor industry segments, the figures above mean one thing to the silicon wafer cleaning technology manufacturers: a promising future for their business. Thus, those individuals/companies who are working and making innovations for silicon wafer cleaning processes should double their effort to continue to innovate in order to serve this rapidly-growing industry even better.
As of today, the kinds of silicon wafer cleaning processes/technologies being utilized in the industry can be classified into three types and these are the following:
Dry cleaning - this particular cleaning technology involves several techniques, which include these processes: Ozonated chemistries (aka UV-ozone clean) that is known to be environmentally friendly alternative to sulfuric acid; Dry Ice (CO2 based; Aerosols, which relies on a momentum transfer mechanism; Vapor Phase; and, the Laser Assisted method.
Wet process - just like the dry process, there are also several techniques used under the wet process and these include: Immersion (immerse cassette in chemical bath); the megasonic cleaning, which is a type of acoustic cleaning that uses vibrational scrubbing method in a non-contact mode; the Centrifugal Spray method, which involves spraying freshly blended chemicals and high purity water; and, Aqueous cleaning that uses at least 95% water in the process.
The dry-wet combination - also known as the alternative method.
While the silicon wafer cleaning process has come a long way from its inception, there is still a room for improvement, which gives an opportunity to serve the semiconductor industry even better. Through continued research and and experiments, manufacturers will surely come up with new technological innovations that help in the industry not just in hastening the processes but will further improve the quality of the product output in the most convenient and inexpensive ways.
About the Author:
Roy Van Rivero has had several years of experience working in the high-tech industry before venturing on the Internet as a web content writer. He uses his prior knowledge to write industry-related topics, including silicon wafer cleaning. He also manages a personal industry blog, which reflects the nature of his present works.
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